generate prodcution files for jlcpcb

1 files changed, 122 insertions, 0 deletions

diff --git a/rev1/Production/RedunDC-job.gbrjob b/rev1/Production/RedunDC-job.gbrjob
new file mode 100644
index 0000000..7c63c22
--- /dev/null
+++ b/rev1/Production/RedunDC-job.gbrjob
@@ -0,0 +1,122 @@
+{
+  "Header": {
+    "GenerationSoftware": {
+      "Vendor": "KiCad",
+      "Application": "Pcbnew",
+      "Version": "6.0.11-2627ca5db0~126~ubuntu22.04.1"
+    },
+    "CreationDate": "2024-05-09T19:34:26+02:00"
+  },
+  "GeneralSpecs": {
+    "ProjectId": {
+      "Name": "RedunDC",
+      "GUID": "52656475-6e44-4432-9e6b-696361645f70",
+      "Revision": "rev?"
+    },
+    "Size": {
+      "X": 48.1,
+      "Y": 40.1
+    },
+    "LayerNumber": 2,
+    "BoardThickness": 1.6,
+    "Finish": "None"
+  },
+  "DesignRules": [
+    {
+      "Layers": "Outer",
+      "PadToPad": 0.2,
+      "PadToTrack": 0.2,
+      "TrackToTrack": 0.2,
+      "MinLineWidth": 0.25,
+      "TrackToRegion": 0.254,
+      "RegionToRegion": 0.254
+    }
+  ],
+  "FilesAttributes": [
+    {
+      "Path": "RedunDC-F_Cu.gbr",
+      "FileFunction": "Copper,L1,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "RedunDC-B_Cu.gbr",
+      "FileFunction": "Copper,L2,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "RedunDC-F_Paste.gbr",
+      "FileFunction": "SolderPaste,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "RedunDC-B_Paste.gbr",
+      "FileFunction": "SolderPaste,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "RedunDC-F_Silkscreen.gbr",
+      "FileFunction": "Legend,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "RedunDC-B_Silkscreen.gbr",
+      "FileFunction": "Legend,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "RedunDC-F_Mask.gbr",
+      "FileFunction": "SolderMask,Top",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "RedunDC-B_Mask.gbr",
+      "FileFunction": "SolderMask,Bot",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "RedunDC-Edge_Cuts.gbr",
+      "FileFunction": "Profile",
+      "FilePolarity": "Positive"
+    }
+  ],
+  "MaterialStackup": [
+    {
+      "Type": "Legend",
+      "Name": "Top Silk Screen"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Top Solder Paste"
+    },
+    {
+      "Type": "SolderMask",
+      "Name": "Top Solder Mask"
+    },
+    {
+      "Type": "Copper",
+      "Name": "F.Cu"
+    },
+    {
+      "Type": "Dielectric",
+      "Material": "FR4",
+      "Name": "F.Cu/B.Cu",
+      "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
+    },
+    {
+      "Type": "Copper",
+      "Name": "B.Cu"
+    },
+    {
+      "Type": "SolderMask",
+      "Name": "Bottom Solder Mask"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Bottom Solder Paste"
+    },
+    {
+      "Type": "Legend",
+      "Name": "Bottom Silk Screen"
+    }
+  ]
+}